Recently, the SOI (Silicon On Insulator) materials and devices group of the State Key Laboratory of Functional Materials for Materials of the Chinese Academy of Sciences Shanghai Institute of Microsystem and Information Technology has made new progress in the study of graphene directly on insulator substrates. The preparation of graphene on the insulator is an important basic condition for promoting the application of graphene in the field of microelectronics. In response to this demand, the researchers of the SOI material and device research group used a ruthenium film as a catalyst and succeeded in the chemical vapor deposition (CVD) method. High-quality single-layer graphene materials were prepared on insulating substrates such as silicon oxide, sapphire, and quartz glass, and successfully applied to electric heating devices such as mist eliminators. Relevant research results were recently published in Small on the Germanium-assisted Direct Growth of Graphene on Arbitrary Dielectric Substrates for Heating Devices (DOI: 10.1002/smll.201700929).
Graphene, because of its excellent physical properties has been widely concerned by the academic community, in order to achieve applications in the field of microelectronics, graphene films need to be transferred or directly grown onto insulating substrates. Directly growing the graphene on the insulating substrate is favorable for obtaining the wafer-level graphene material, which is of great significance for promoting the application of the graphene material in the fields of integrated circuits and the like. However, since the insulating substrate itself does not have catalytic capabilities, the use of Cu (copper), Ni (nickel) and other metal catalysts will inevitably introduce metal contamination, so this research has always faced many challenges. Wang Ziwen and Xue Zhongying from the State Key Laboratory of Information Functional Materials at Shanghai Institute of Microsystems based on the research basis for the growth of high-quality single-layer graphene on ruthenium substrates, preliminarily depositing a ruthenium film as a catalyst on an insulating substrate, and optimizing graphene The growth temperature and the growth time allow the full coverage of the monolayer graphene on the surface of the insulating substrate to be completely evaporated while the germanium thin film is completely evaporated. In the study, they also found that the shape of graphene is completely dependent on the shape of the germanium film. Therefore, the method can not only achieve the growth of the wafer-level graphene film, but also can define the graphs required for subsequent graphene devices through the pre-designed germanium patterns. Growth. The graphene material obtained on the insulator exhibits good electrical properties, and its application in heating devices such as demisting and electrochromism is initially demonstrated. This study laid the foundation for obtaining graphene on wafer-level insulators, which helps to promote the application of graphene materials in the field of microelectronics.
This work has been funded by the “Millions of People Plan†Youth Top Talent Project, the Frontier Science Key Research Project of the Chinese Academy of Sciences, and the Shanghai Outstanding Program Leader Program.
Characteristics and Advantages
(1) Intelligent control design: adjustable main parameter and secondary parameter automatically according to the weight of door leaves;
(2) Low noise: Special static sound track, integration of motor, worm-gear and retarder.
(3) Anti-clamping function: automatically reverse when meeting barriers;
(4) Unique electronic motor lock: the motor will lock up when the door is forced to open.(controlled by remote or switch)
(5) Tighten force: seal door when closed, power consumption approximately 10W under standby;
(6) Advanced brushless motor(36V,100W) can automatically adopt different heavy door leaves;
(7) Bi-doors inter-locking: one of the door leaves always remains closing;
(8)Safety sensor terminal: sensor stops working when door closed;
(9)Unique coating technology: never rusty;
(10)Easy and convenient to install;
(11)Working Process: when the door leaf closes to the right place, the door leaf will slightly shift to the door frame and the ground. The rubbers on the four sides of the door leaf will completely combine with door frame and ground, which ensures air tightness. When the door is open, the rubbers will separate from door frame and ground, which avoids contraction on the ground.
Technical Specification
Specification |
Light Duty |
Heavy Duty |
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Rang of the Door |
Single-Leaf |
Double-Leaf |
Single-Leaf |
Double-Leaf |
Door leaf max weight |
100kg |
100kg x 2 |
200kg |
200kg x 2 |
Mounting Method |
Surface mounting or built-in mounting |
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Open Width |
700-2000mm |
650-2000mm |
750-2000mm |
650-2000mm |
Power Supply |
AC 220v ± 10%, 50-60 Hz |
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Opening Speed |
300-500mm/s (adjustable) |
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Closing Speed |
250-550mm/s (adjustable) |
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Creep speed |
30-100mm/s (adjustable) |
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Hold-open time |
0.5-20s (adjustable) |
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Airproof Force (Max.) |
>70N |
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Manual Pushing Force |
<100N |
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Electronic Lock Force |
>800N |
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Power consumption |
150W |
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Ambient temperature |
-20+50 C |
Technical Details:
(1) Rubber lining sealing technology combined with V groove on the guide rail enables the door completely sealed when the door closed;
(2)Special door body location technology. Semicircular surface beam on the ground matches with the V style groove at the bottom of door leaf, which stop the door from swing and make sure it moves stable and smooth;
(3) The door body decorated with matte stainless steel or spray surface, and on the middle and both sides with sealing stripes to ensure the hermetic effect.
(4)Feet sensor switch applied to avoid contagion;
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Shenzhen Hongfa Automatic Door Co., Ltd. , https://www.highspeedshutterdoor.com